Photo & e-beam resist

1. Photo resist product list
  •  
    Positive and negative photo resist
     
    Easy removal, SU-8 대응 제품
     
    저렴한 ESPACER 대응 제품
     
    SurPass, AR 300-80, HMDS: Adhesion promoter
     
    Lift-off resist
     
    Wet etching protection resist
     
    Thinner, developer and remover
     
    이외 다양한 제품 및 대응 제품 취급
Photo resist product list ▼

이외 다양한 제품 및 대응 제품을 취급하고 있습니다. 찾으시는 제품이 없는 경우 문의 주시길 바랍니다.

Photo resist product list

Type
 Resist Description
 Thinner
 Developer
 Remover
Positive
  KL 5300

 0.12-2.5  μm FT, high  sensitivity and
 throughput, CD 0.55 μm, IC fabrication

  -  TMAH  NMP,
 DMSO
 KL 6000  2.2-10 μm FT, high sensitivity and throughput  -  TMAH
  NMP,
 DMSO
 KL P4800  10-25 μm FT, packaging application,
 high sensitivity and throughput		  -  TMAH,
 KOH		  NMP
 AR-P 1200  Spray resist, var. applications  -  300-44  600-71
 300-73
 AR-P 3100  High resolution, adhesion-enhanced  300-12  300-35
 300-26		  300-76
 300-73
 AR-P 3200  Thick resist with high dimen. accuracy
 up to 100 μm		  300-12  300-26  600-71
 300-76
 AR-P 3500  Wide process range, high resolution  300-12  300-35
 300-26		  600-71
 300-73
 AR-P 3500 T  Wide process range, high res.,
 developable in 0.26n TMAH		  300-12  300-44
 300-26		  300-76
 600-71
  AR-P 3700,
 3800		  Highest resolution, sub-μm, high contrast,
 3840 dyed		  300-12  300-47
 300-26		  600-71
 300-76
 AR-P 5300  Undercut structure (single layer lift-off)  300-12  300-26  600-76
 300-73
Negative
  HARE SQ  1-100 μm FT, fully compatible with SU-8,
 MEMS application		  -  SQ developer  N/A
 KL LO 1600  2-9 μm FT, lift-off profile  -  300-44  600-71
 300-73
 AR-N 2200  Spray  resist, var. applications  -  300-44  600-71
 300-73
 AR-N 4200  Highly sensitive, high resolution  300-12   300-26
 300-47		  600-71
 300-76
 AR-N 4300  Highest sensitivity, high resolution, CAR  300-12  300-26
 300-475		  600-76
 300-72
 AR-N 4400  Thick films up to 100, 50, 20, 10 μm,
 easy removal		  300-12  300-44
 300-475		  600-71
 600-70
 AR-N 4450  Thick films up to 20 μm, lift-off  300-12  300-47  600-71
 600-70
  

Special

Application 

  KL IR 15,
 IR 15 Lift Off		  1.2-2.6 μm FT, image reversal, lift-off  -  TMAH  NMP,
 DMSO
 AR-U 4000
  Optionally pos. or neg., lift-off  300-12  300-35
 300-26		  600-72
 300-76
 AR-PC 500  Protective coating, 40% KOH etch-stable  600-01   -  600-71
 300-76
 AR-BR 5400  Bottom resist for 2 L lift-off  -  -  300-73
 300-76
 AR-P 5900
  Complicated pattern. up to 5% HF / BOE  300-12   300-26  300-76
 300-73
 DisCharge  Conductive resist; Efficient charge dissipation  -   -   DI water or IPA
 SurPass  Adhesion promoter photo and  e-beam resists  -  -  DI water or IPA